ELECTROMIGRATION INDUCED EDGE VOID DYNAMICS ON THE INTERCONNECT SURFACE

Six Fold Crystal Symmetry, {111} Planes in FCC

The {111} planes they have the highest symmetries compared to all other crystal planes in FCC structure. The orientation of the surface with zero tilt angle with respect to the electron wind direction at low current densities doesn’t create very much trouble. As may be seen in Figure the edge-void while dragging towards the cathode end, with increasing in intensity, changes its form into a kink-shape, which is somewhat tilted towards the windward side. This form may cause an opencircuit failure by reaching the other edge but the failure time becomes very long relative to the interconnects having surfaces with other crystalline textures (symmetries). At moderate and high electron wind intensities, the tip of the kinkshape edge-void extents to much to the interior and a bottle neck forms. This bottle neck region finally breaks down, and creates very large internal void in wedge shape, which touches the opposite edge causes fatal circuit shut down.
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