ELECTROMIGRATION INDUCED EDGE VOID DYNAMICS ON THE INTERCONNECT SURFACE

Four Fold Crystal Symmetry, {100} Planes in FCC

We also investigated the case where the tilt angle is θ=30 degrees, and the general evolution behavior is demonstrated in Figure for low and moderate electron wind intensities χ= 5-10. The void shows some shape variations while decaying and disappearing completely without leaving any trace on the otherwise flat surface. However, at very high electron winds χ≥ 50 a round shape daughter void may be created, which migrates towards the cathode edge. There may be multiple daughter void emanating from the same source at later times.