Recent Publication:
 
 
   
Simulation Centre:
 
A user - interactive tool for computing MTF
   
Animation Centre:
 
Watch and Download animations resulting from our simulations!
 
   
   
   
   
   
   
   
   
   
   
   
   

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

© 2005 CSL

CSL focuses on two interdisciplinary areas: Electromigration and Mechanical Spectroscopy. Click on the links below for a description of each project.


Intragranular Void Motion in unpassivated lines with anisotropy and the void growth


Void morphology evolution for a Critical initial void configuration lying on a (110) plane along [110] direction under the Anisotropic surface diffusion and Void Growth conditions.

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Intragranular Void Motion in unpassivated lines

Kinematics behavior of void motion is described in terms of instantaneous velocity and acceleration related to center of gravity. In the AVI format site, upper right corner figure shows position versus time plot similarly lower right corner figure gives acceleration versus time plot...

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Intergranual void motion in un-passivated lines with Void - Grain Boundary Interaction

Snap shuts from the void grain boundary interaction are presented, where only the capillary forces are taken into account. This figure shows that the void and grain boundary combine system starts to evolve towards the equilibrium configuration having proper dihedral angles dictated by thermostatic theory, as soon as they have in close contact with each others.

 


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Electromigration Induced Hillock and Edge Void Dynamics on The Interconnect Surface


The interconnect having two fold symmetry, {110} Planes in FCC, with zero degree tilt angle θ=0 with respect to the electric field direction tends to transform the Gaussian hape edgevoid into the slit like shape stretched to the windward direction. Eventually, the tip of this slit type void breaks down and generates an internal void having various different in forms.

 

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Grain Boundary Grooving and Cathode Voiding and Drifting induced by EM & Capillary Forces


Thermal grooving, effect of EM on grooving kinetics, cathode voiding and drifting...

One should try to select those materials for the underlayers that they can be able to modify the properties of the interfacial layers to obtain low specific surface Gibbs energies, high specific  resistivity and diffusion coefficients.

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Internal Friction

Selective Kink Decoration Model
The internal friction coefficients associated with the spread-out host interstitials as well as the decorator point defects were simulated using the discrete kink-chain model of dislocation damping.

Interactive Geometric Kink Model
The first dissipation regime, which occurs at low concentrations and low couplings, may be called as the dislocation induced Cottrell relaxation DICR (or dislocation enhanced Snoek relaxation, DESE) for spherical point defects.

Sintering



Application of Ogurtani theory to sintering. Check out preliminary results.