Oncu AKYILDIZ

Computer simulation of grain boundary grooving by anisotropic surface drift diffusion due to capillary, electromigration and elastostatic forces

Ph. D. Thesis, Middle East Technical University, May 2010.
Mentor: Prof. Dr. Tarik Omer OGURTANI

Oncu AKYILDIZ                                                                                     

Computer Simulation of Grain-Boundary Grooving and Cathode Voiding in Bamboo Interconnects by Surface Diffusion under Capillary and Electromigration Forces

M. Sc. Thesis, Middle East Technical University, September 2004.
Mentor: Prof. Dr. Tarik Omer OGURTANI

Oncu AKYILDIZ, and Tarik O. OGURTANI, Abstract

Grain boundary grooving induced by the anisotropic surface drift diffusion driven by the capillary and electromigration forces: Simulations.

Journal of Applied Physics, 110, 043521 (2011); doi:10.1063/1.3624733

Oncu AKYILDIZ, Ersin Emre OREN and Tarik O. OGURTANI, Abstract

Mesoscopic nonequilibrium thermodynamics treatment of the grain boundary thermal grooving induced by the anisotropic surface drift diffusion.

Journal of Materials Science, 46, 18, 6054-6064 (2011). doi: 10.1007/s10853-011-5567-8

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract                                              

Morphological evolution of voids by surface drift-diffusion driven by the capillary, electromigration and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip chip solder joints: Part-II (Applications)

Journal of Applied Physics, 104, 023522 (2008).

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract                                              

Morphological evolution of voids by surface drift-diffusion driven by the capillary, electromigration and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip chip solder joints: Part-I (Theory)

Journal of Applied Physics, 104, 023521 (2008).

Also featured in:
Virtual Journal of Nanoscale Science & Technology, August 4, 2008, Volume 18, Issue 5

Tarik O. OGURTANI, Oncu AKYILDIZ, and Ersin Emre OREN,  Abstract                

Morphological evolution of tilted grain-boundary thermal grooving by surface diffusion in bicrystal thin solid films having strong anisotropic surface Gibbs free energies

Journal of Applied Physics, 104, 013518 (2008).

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract

Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

International Journal of Solids and Structures, Volume 45, Issues 3-4, February 2008, 921-942

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract                              

Grain Boundary Grooving and Cathode Voiding in Bamboo-Like Metallic Interconnects by Surface Diffusion Under Capillary and Electromigration Forces

Journal of Applied Physics, Volume 97, 093520 May 1, 2005.                         

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract

Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints

Solid State Phenomena, Volume 139, pp.151, 2008
Selected, peer reviewed papers from the Symposium: Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior organized within the MRS Fall Meeting 2007 held in Boston MA, USA, November 26-30, 2007. Editors: Veena Tikare, Graeme E. Murch, Frédéric Soisson and Jeung Ku Kang

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract

Computer Simulations on Grain Boundary Grooving and Cathode Edge Displacement in Bamboo-Like Metallic Interconnects

in Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
Editors: T.Y. Tsui, Y-C. Joo, A.A. Volinsky, M. Lane, L. Michaelson
Mater. Res. Soc. Symp. Proc. 914 , Warrendale, PA, 2006, 0914-F09-22.

Tarik O. OGURTANI and Oncu AKYILDIZ *

Morphological Evolution of Intragranular Void by Surface Drift-diffusion Driven by the Capillary, Electromigration and Thermal-stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films.

MRS 2007 Fall Meeting

"Symposium E: Theory, Modeling, and Numerical Simulation of
Multiphysics Materials Behavior"
Boston, Massachusetts, USA.
Poster Presentation, November 26-30, 2007

Tarik O. OGURTANI and Oncu AKYILDIZ *

Computer simulations on the grain boundary grooving and cathode edge displacement in bamboo-like metallic interconnects.

MRS 2006 Spring Meeting

"Symposium F: Materials, Technology, and Reliability of
Low-k Dielectrics and Copper Interconnects"
San Francisco, California, USA.
Poster Presentation, April 17-21, 2006 Nominee for poster awards among 23 other in Symp. F.