Oncu AKYILDIZ, and Tarik O. OGURTANI, Abstract

Grain boundary grooving induced by the anisotropic surface drift diffusion driven by the capillary and electromigration forces: Simulations.

J. Appl. Phys. 110, 043521 (2011); doi:10.1063/1.3624733

Oncu AKYILDIZ, Ersin Emre OREN and Tarik O. OGURTANI, Abstract

Mesoscopic nonequilibrium thermodynamics treatment of the grain boundary thermal grooving induced by the anisotropic surface drift diffusion.

J. Mater. Sci. 46, 18, 6054-6064 (2011). doi: 10.1007/s10853-011-5567-8

Tarik O. OGURTANI, Aytac CELIK, and Ersin Emre OREN, Abstract   

Generic role of the anisotropic surface free energy on the morphological evolution in a strained-heteroepitaxial solid droplet on a rigid substrate.

J. Appl. Phys. 108, 103516 (2010); doi:10.1063/1.3512970

Tarik O. OGURTANI, Aytac CELIK, and Ersin Emre OREN, Abstract   

Morphological evolution in a strained-heteroepitaxial solid droplet on a rigid substrate: Dynamical simulations.

J. Appl. Phys. 108, 063527 (2010); doi:10.1063/1.3483937

Tarik O. OGURTANI, Abstract

The orientation dependent electromigration induced healing on the surface cracks and roughness caused by the uniaxial compressive stresses in single crystal metallic thin films.

J. Appl. Phys. 106, 053503 (2009); doi:10.1063/1.3211855

Tarik O. OGURTANI, Abstract                                             

Thermal grain-boundary grooving in bicrystal thin solid films having strong anisotropic surface Gibbs free energy represented by the modified cycloid-curtate function.

Journal of Crystal Growth 311, 1584-1593 (2009)

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract                                              

Morphological evolution of voids by surface drift-diffusion driven by the capillary, electromigration and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip chip solder joints: Part-II (Applications)

Journal of Applied Physics, 104, 023522 (2008).

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract                                              

Morphological evolution of voids by surface drift-diffusion driven by the capillary, electromigration and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip chip solder joints: Part-I (Theory)

Journal of Applied Physics, 104, 023521 (2008).

Also featured in:
Virtual Journal of Nanoscale Science & Technology, August 4, 2008, Volume 18, Issue 5

Tarik O. OGURTANI, Oncu AKYILDIZ, and Ersin Emre OREN,  Abstract                

Morphological evolution of tilted grain-boundary thermal grooving by surface diffusion in bicrystal thin solid films having strong anisotropic surface Gibbs free energies.

Journal of Applied Physics, 104, 013518 (2008).

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract                                            

Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

International Journal of Solids and Structures, Volume 45, Issues 3-4, February 2008, 921-942

Tarik O. OGURTANI, Abstract                                                                              

Dirichlet extremum problem associated with the asymmetric grain-boundary groove topography under the Dirac delta type anisotropic surface stiffness in bicrystal thin solid films.

Journal of Applied Physics, 102, 063517 (2007) (19 pages)

Tarik O. OGURTANI, Aytac CELIK, and Ersin Emre OREN, Abstract

Morphological evolution of edge-hillocks on single crystal films having anisotropic drift-diffusion under the capillary and electromigration forces.

Thin Solid Films, Volume 515, Issue 5, 22 January 2007, Pages 2974-2983.

Tarik O. OGURTANI, Abstract

Unified theory of linear instability of anisotropic surfaces and interfaces under capillary, electrostatic and elastostatic forces: The regrowth of epitaxial amorphous silicon.

Physical Review B, Volume 74, 155422 October 20, 2006.

Also featured in:
Virtual Journal of Nanoscale Science & Technology, November 6, 2006, Volume 14, Issue 1

Tarik O. OGURTANI and Aytac CELIK, Abstract

Surface morphological evolution on single crystal films by strong anisotropic drift diffusion under capillary and electromigration forces.

Journal of Applied Physics, Volume 100, 043504 Aug 17, 2006.

Tarik O. OGURTANI, Abstract

Variational formulation of irreversible thermodynamics of surfaces and interfaces with triple junction singularities under the capillary and electromigration forces in anisotropic two-dimensional space.

Physical Review B, Volume 73, 235408 June 13, 2006.

Also featured in:
Virtual Journal of Nanoscale Science & Technology, June 26, 2006, Volume 13, Issue 25

Tarik O. OGURTANI, Abstract

Mesoscopic nonequilibrium thermodynamics of solid surfaces and interfaces with triple
junction singularities under the capillary and electromigration forces in anisotropic three-dimensional space.

Journal of Chemical Physics, Volume 124, 144706 April 14, 2006.

Also featured in:
Virtual Journal of Nanoscale Science & Technology, April 24, 2006, Volume 13, Issue 16

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract

Grain Boundary Grooving and Cathode Voiding in Bamboo-Like Metallic Interconnects by Surface Diffusion Under Capillary and Electromigration Forces

Journal of Applied Physics, Volume 97, 093520 May 1, 2005.

Tarik O. OGURTANI and Ersin Emre OREN, Abstract

Irreversible Thermodynamics of Interfacial Triple Junctions with a Special Reference to the Void Intergranular Motion under the Electromigration Forces

International Journal of Solids and Structures, Volume 42, Issue 13, June 2005 , Pages 3918-3952

Tarik O. OGURTANI and Ersin Emre OREN, Abstract

Electromigration-Induced Void Grain-Boundary Interactions: The Mean Time to Failure for Copper Interconnects with Bamboo and Near-Bamboo Structures

Journal of Applied Physics, Volume 96, Number 12, pp. 7246-7253 December 15, 2004.

Tarik O. OGURTANI, M. Rauf GUNGOR, and Ersin Emre OREN, Abstract

Interactive Computer Simulation of Dislocation Damping Spectra Associated with the Coupled Motion of Geometric Kinks and Point Defects Subjected to Bulk Segregation

Solid State Phenomena, Volume 89, pp 141-190, 2003.

Tarik O. OGURTANI, M. Rauf GUNGOR, and Ersin Emre OREN, Abstract

Simulation of Dislocation Damping Spectra Associated with the Collective Motion of Point Defects and Kink Chain Subjected to Bulk Segregation

Journal of Applied Physics, Volume 91, Issue 4, pp. 1860-1870 February 15, 2002.

Tarik O. OGURTANI and Ersin Emre OREN, Abstract

Computer Simulation of Void Growth Dynamics Under the Action of Electromigration and Capillary Forces in Narrow Thin Interconnects

Journal of Applied Physics, Volume 90, Issue 3, pp. 1564-1572 August 1, 2001.

Tarik O. OGURTANI, Abstract

Mathematical modelling of decoration peak associated with dragging point defects situated selectively at the kink chain with special references to hydrogenated BCC and FCC metals

Applied Mathematical Modelling, Volume 21, Issue 1, pp. 26-41 January 1997.

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract

Morphological Evolution of Intragranular Void under the Thermal-Stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films: Special Reference to Flip Chip Solder Joints

Solid State Phenomena, Volume 139, pp.151, 2008
Selected, peer reviewed papers from the Symposium: Theory, Modeling and Numerical Simulation of Multi-Physics Materials Behavior organized within the MRS Fall Meeting 2007 held in Boston MA, USA, November 26-30, 2007. Editors: Veena Tikare, Graeme E. Murch, Frédéric Soisson and Jeung Ku Kang

Tarik O. OGURTANI and Oncu AKYILDIZ, Abstract

Computer Simulations on Grain Boundary Grooving and Cathode Edge Displacement in Bamboo-Like Metallic Interconnects

in Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
Editors: T.Y. Tsui, Y-C. Joo, A.A. Volinsky, M. Lane, L. Michaelson
Mater. Res. Soc. Symp. Proc. 914 , Warrendale, PA, 2006, 0914-F09-22.

Tarik O. OGURTANI, M. Rauf GUNGOR and Ersin Emre OREN, Abstract

Interactive Computer Simulation of Dislocation Damping Spectra Associated with the Coupled
Motion of Geometric Kinks and Point Defects Subjected to the Bulk Segregation Phenomenon

Mechanical Spectroscopy II, Solid State Phenomena, Volume 89-90, pp. 141-191
Editor: L. B. Magalas
Trans Tech Publications, Switzerland, 2003.
ISBN 3-908450-74-8

Ersin Emre OREN and Tarik O. OGURTANI, Abstract

Void Intergranual Motion Under the Action of Electromigration Forces in Thin Film Interconnects with Bamboo Structure

MRS 2001 Fall Meeting, V695, pp L5.5.1-L.5.5.7
Editors: C.S. Ozkan, R.C. Cammarata, L.B. Freund, H. Gao, The Materials Research Society, USA, 2002,
ISBN 1-55899-631-1

Ersin Emre OREN and Tarik O. OGURTANI, Abstract

The Effect of Initial Void Configuration on the Morphological Evolution Under the Action of Normalized Electron Wind Forces

MRS 2001 Spring Meeting, V714 E, pp L9.2.1-L9.2.6
Editor: S. Lahiri, The Materials Research Society, USA, 2001,

Tarik O. OGURTANI, and Ersin Emre OREN, Abstract

A Computer Simulation of Void Dynamics under the Action ofElectromigration and Capillary Forces in Narrow Thin Interconnects

Advanced Metallization Conference 2000 (AMC 2000), V16, pp 483-487.
Editors: D. Edelstein, G. Dixit, Y. Yasuda, T. Ohba, The Materials Research Society, USA, 2001,
ISBN: 1-55899-574-9

Tarik O. OGURTANI and Oncu AKYILDIZ , Abstract

Morphological Evolution of Intragranular Void by Surface Drift-diffusion Driven by the Capillary, Electromigration and Thermal-stress Gradient Generated by the Steady State Heat Flow in Encapsulated Metallic Films.

MRS 2007 Fall Meeting

"Symposium E: Theory, Modeling, and Numerical Simulation of
Multiphysics Materials Behavior"
Boston, Massachusetts, USA.
Poster Presentation, November 26-30, 2007

Tarik O. OGURTANI and Oncu AKYILDIZ , Abstract

Computer simulations on the grain boundary grooving and cathode edge displacement in bamboo-like metallic interconnects.

MRS 2006 Spring Meeting

"Symposium F: Materials, Technology, and Reliability of
Low-k Dielectrics and Copper Interconnects"
San Francisco, California, USA.
Poster Presentation, April 17-21, 2006 Nominee for poster awards among 23 other in Symp. F.

Ersin Emre OREN and Tarik O. OGURTANI, Abstract

Interactive Computer Simulation of Dislocation Damping Spectra Associated with the Coupled Motion of Geometric Kinks and Point Defects Subjected to the Bulk Segregation Phenomenon.

ICIFUAS 13: 13th International Conference on Internal Friction and Ultrasonic Attenuation in Solids and 1st Scientific Exhibition on Mechanical Spectroscopy Equipment
Bilbao, Spain.
Submitted for Oral Presentation, July 8-12, 2002

Ersin Emre OREN and Tarik O. OGURTANI, Abstract

Void Intergranual Motion Under The Action of Electromigration Forces in Thin film Interconnects with Bamboo Structure

MRS 2001 Fall Meeting

Symposium L: Thin Films-Stresses and Mechanical Properties IX"
Boston, Massachusetts, USA.
Oral Presentation, November 26-30, 2001

Ersin Emre OREN and Tarik O. OGURTANI,

Mathematical Modeling of the Void Evolution Dynamics Under the Action of Electromigration and Cappilary Forces in Thin Interconnects

International Conference on Mathematical Modeling and Scientific Computing
Middle East Technical University and Selçuk University
Ankara and Konya, Turkey.
Oral Presentation, April 2-6, 2001

Ersin Emre OREN and Tarik O. OGURTANI, Abstract

The Effect of Initial Void Configuration on the Morphological Evolution Under theAction of Normalized Electron Wind Forces

MRS 2001 Spring Meeting

"Symposium L: Materials, Technology, and Reliability for Advanced
Interconnects and Low-k Dielectrics"
San Francisco, California, USA.
Poster Presentation, April 16-20, 2001

Tarik O. OGURTANI, M. Rauf GUNGOR and Ersin Emre OREN, Abstract

Interactive Computer Simulation of Dislocation Damping Spectra Associated with the CoupledMotion of Geometric Kinks and Point Defects Subjected to the Bulk Segregation Phenomenon

Second International School on Mechanical Spectroscopy MS - 2

Kraków-Krynica, Poland.
Invited Presentation, December 3-8 , 2000

Tarik O. OGURTANI and Ersin Emre OREN, Abstract

Computer Simulation of Void Growth Dynamics Under The Action ofElectromigration and Capillary Forces in Narrow Thin Interconnects

Advanced Metallization Conference (AMC) 2000
"P.IV: Reliability and Modeling "
San Diego, California, USA.
Poster Presentation, October 3-5, 2000