Introduction

Theory

Experimental
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Results

Conclusions

 

 

 

 

 

 

 

 

 

© 2005 CSL

Experimental Setup: Boundary conditions for electromigration grooving.

Effect of Electromigration (ksi != 0)

Free Moving Boundary Condition: This BC assumes that there is no direct contact with electrode pads at the cathode and/or anode edges. The whole interconnect test piece rests on a substrate (TiN or Mo, W), which has very high specific resistivity compared to the interconnect material.
1) Cathode Voiding.
2) Cathode Drifting.